乐泰UF3808，LOCTITE UF3808乐泰UF3810，Hysol UF3808，10ML

批量供应乐泰UF3808 ，乐泰UF3810,乐泰3810，乐泰3808,10ml 30ml乐泰UF3808，乐泰3517,乐泰3513</p><p>汉高乐泰胶水\昆山\上海\吴江\广州\佛山代理销售处：137\51\13\63\32.陈生 Q.Q/30/22/24/564/ 网.址。w.w.w.a.a.l.o.c.t.i.t.e.c.o.m.</p><p>Hysol UF3808 /LOCTITE UF3808capillary underfill is designed to cure quickly at low</p><p>temperatures to minimize stress to other components. When</p><p>cured, this material provides excellent mechanical properties to</p><p>protect solder joints during thermal cycling.</p><p>LOCTITE UF3810 reworkable epoxy underfill is designed for CSP and</p><p>BGA applications. It cures quickly at moderate temperatures to</p><p>minimize stress to other components. When cured, this</p><p>material provides excellent mechanical properties to</p><p>protect solder joints during thermal cycling.</p><p>LOCTITE ECCOBOND UF 3915 provides the following product</p><p>characteristics:</p><p>Technology Epoxy</p><p>Appearance Black liquidLOCTITE ECCOBOND UF 3820</p><p>Cure Snap Cure or Heat cure</p><p>Product Benefits ● Halogen free</p><p>● One component</p><p>● Snap curable</p><p>● Fast flow</p><p>● High Tg</p><p>● Easy rework</p><p>● High fracture toughness</p><p>● Excellent thermal cycle performance</p><p>● Compatible with most Pb-free solders</p><p>● Stable electrical performance under</p><p>thermal/humidity bias